The heat dissipation of DC-DC converters is an important design. In this article, we will discuss what are the heat dissipation methods of the DC-DC converter package on PCB and what are the specific performance of the heat dissipation methods of the DC-DC converter package on PCB.
Here is the content list:
What are the heat dissipation methods of the DC-DC converter package on PCB?
What is the specific performance of the heat dissipation method of the DC-DC converter package on PCB?
What are the heat dissipation methods of the DC-DC converter package on PCB?
There are two main ways to dissipate heat from the DC-DC converter package on PCB.
1. Heat dissipation through the PCB: If the converter IC is in a surface mount package, the thermally conductive copper vias and spacers on the PCB will dissipate heat from the bottom of the package. If the thermal resistance of the package to the PCB is very low, the use of this cooling method is sufficient.
2. Increase airflow: Use cold airflow to remove the heat from the package. More precisely, the heat is transferred to the faster moving cooler air molecules in contact with the package surface. There are also passive heat dissipation methods and active heat dissipation methods.
What is the specific performance of the heat dissipation method for DC-DC converter packages on PCBs?
1. In the face of rising component temperatures, PCB designers can go from the standard thermal toolbox to the usual tools, such as adding copper, adding a heat sink, using larger and faster fans, or you can simply increase the space - use more PCB space, increase the distance between components on the PCB, or increase the PCB layer thickness.
2. A well-designed package can dissipate heat efficiently and evenly through the surface, thereby eliminating hot spots that can cause degradation of the POL regulator's performance. The PCB is responsible for absorbing and routing most of the heat from a surface-mounted POL regulator. As forced airflow cooling methods become increasingly popular in today's high-density and high-complexity systems, well-designed POL regulators should also take advantage of this free cooling opportunity for heat-generating components such as MOSFETs and inductors.
3. Direct heat from the top of the package to the air: High power switching POL regulators use an inductor or transformer to convert the input supply voltage to a regulated output voltage. In a non-isolated step-down POL regulator, the device uses an inductor. The inductor and associated switching elements generate heat during the DC-DC conversion process.
4. Using vertical mode: POL modular regulator with stacked inductors as heat sinks. The size of the inductor in the POL regulator depends on the voltage, switching frequency, current handling performance, and construction. In a modular design, the DC-DC circuit (including the inductor) is over-molded and sealed in a plastic package, similar to an IC; the inductor, rather than any other component, determines the thickness, volume, and weight of the package. Inductors are also a significant source of heat.
5. 3D packages with exposed stacked inductors: Keep the footprint small, increase power, and perfect heat dissipation. Smaller PCB footprint, higher power, and better thermal performance. 3D packages can achieve all three goals at the same time.
The heat dissipation method of the DC-DC converter affects the experience of using it. In more than a decade of power supply and sensor research and development. We always adhere to the purpose of "customer first, the brand first, technology to improve life" and the commitment of "quality, integrity, best service, latest technology", and are committed to wholehearted service, providing quality products, meeting diversified customer needs, and meeting Diversified market demand. If you have relevant needs, welcome to visit our official website: https://www.smunchina.com. for consultation and understanding. Thank you very much for your support.
